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DATA SHEET DATA SHEET
MOS INTEGRATED CIRCUIT
PD16311
1/8- to 1/16-DUTY FIPTM (VFD) CONTROLLER/DRIVER
The PD16311 is a FIP (Fluorescent Indicator Panel or Vacuum Fluorescent Display) controller/driver that is driven on a 1/8- to 1/16 duty factor. It consists of 12 segment output lines, 8 grid output lines, 8 segment/grid output drive lines, a display memory, a control circuit, and a key scan circuit. Serial data is input to the PD16311 through a three-line serial interface. This FIP controller/driver is ideal as a peripheral device of a single-chip microcomputer.
FEATURES
* Many display modes (12-segment & 16-digit to 20-segment & 8-digit) * Key scanning (12 4 matrices) * Dimming circuit (eight steps) * High-voltage output (VDD 35 V max). * LED ports (5 chs., 20 mA max). * General-purpose input port (4 bits) * No external resistor necessary for driver outputs (P-ch open-drain + pull-down resistor output) * Serial interface (CLK, STB, DIN, DOUT)
ORDERING INFORMATION
Part Number Package 52-pin plastic QFP ( 14)
PD16311GC-AB6
Document No. IC-3306 (1st edition) Date Published March 1997 P Printed in Japan
(c)
1993
PD16311
BLOCK DIAGRAM
Dimming circuit
Command decoder
DIN DOUT Serial I/F CLK STB VDD Timing generator key scan 16-bit shift register Data selector R OSC 8 Segment/grid driver 20-bit output latch Segment driver
Seg1
Display memory 20 bit x 16 Word
20
12
Seg12
8
Seg13/Grid16
Seg20/Grid9
Key data memory (4 x 12) Key1 to Key4
8 Grid driver Grid1 Grid8
4
16
8
4-bit latch
SW1 to SW4
5-bit latch VDD (+5 V) LED1 LED5 VSS VEE (0 V) (-30 V)
4
2
PD16311
PIN CONFIGURATION (Top View)
50 LED1 49 LED2 48 LED3 47 LED4 46 LED5 44 Grid1 43 Grid2 42 Grid3 41 Grid4 40 Grid5 39 Grid6 38 Grid7 37 Grid8 36 Seg20/Grid9 35 Seg19/Grid10 34 VEE 33 VDD 32 Seg18/Grid11 31 Seg17/Grid12 30 Seg16/Grid13 29 Seg15/Grid14 28 Seg14/Grid15 27 Seg13/Grid16 VDD 14 Seg1/KS1 15 Seg2/KS2 16 Seg3/KS3 17 Seg4/KS4 18 Seg5/KS5 19 Seg6/KS6 20 Seg7/KS7 21 Seg8/KS8 22 Seg9/KS9 23 Seg10/KS10 24 Seg11/KS11 25 Seg12/KS12 26 52 OSC
SW1 SW2 SW3 SW4 DOUT DIN IC CLK STB
1 2 3 4 5 6 7 8 9
KEY1 10 KEY2 11 KEY3 12 KEY4 13
Use all the power pins. Leave the IC pin open.
45 VDD
51 VSS
3
PD16311
Pin Function
Pin No. 6 Symbol DIN Pin Name Data input Description Inputs serial data at rising edge of shift clock, starting from lower bit. Outputs serial data at falling edge of shift clock, starting from lower bit. This is N-ch open-drain output pin. Initializes serial interface at rising or falling edge to make
5
DOUT
Data output
9
STB
Strobe
PD16311 waiting for reception of command. Data input after
STB has fallen is processed as command. While command data is processed, current processing is stopped, and serial interface is initialized. While STB is high, CLK is ignored. 8 52 15 to 26 CLK OSC Seg1/KS1 to Seg12/KS12 Grid1 to Grid6 Seg13/Grid16 to Seg20/Grid9 LED1 to LED5 Key1 to Key4 SW1 to SW4 VDD VSS VEE IC Clock input Oscillator pin High-voltage output (segment) High-voltage output (grid) High-voltage output (segment/grid) LED output Key data input Switch input Logic power Logic ground Pull-down level Internally connected Reads serial data at rising edge, and outputs data at falling edge. Connect resistor for determining oscillation frequency to this pin. Segment output pins (Dual function as key source)
44 to 37 27 to 32 35 to 36 50 to 46 10 to 13 1 to 4 14, 33, 45 51 34 7
Grid output pins These pins are selectable for segment or grid output.
CMOS output. +20 mA max. Data input to these pins is latched at end of display cycle. These pins constitute 4-bit general-purpose input port. 5 V 10 % Connect this pin to GND of system. VDD 35 V max. Be sure to leave this pin open (this pin is at VDD level).
4
PD16311
Display RAM Address and Display Mode The display RAM stores the data transmitted from an external device to the PD16311 through the serial interface, and is assigned addresses as follows, in units of 8 bits:
Seg1 00 HL 03 HL 06 HL 09 HL 0 CHL 0 FHL 12 HL 15 HL 18 HL 1 BHL 1 EHL 21 HL 24 HL 27 HL 2 AHL 2 DHL Seg4 00 HU 03 HU 06 HU 09 HU 0 CHU 0 FHU 12 HU 15 HU 18 HU 1 BHU 1 EHU 21 HU 24 HU 27 HU 2 AHU 2 DHU Seg8 Seg12 01 HL 04 HL 07 HL 0 AHL 0 DHL 10 HL 13 HL 16 HL 19 HL 1 CHL 1 FHL 22 HL 25 HL 28 HL 2 BHL 2 EHL Seg16 01 HU 04 HU 07 HU 0 AHU 0 DHU 10 HU 13 HU 16 HU 19 HU 1 CHU 1 FHU 22 HU 25 HU 28 HU 2 BHU 2 EHU Seg20 02 HL 05 HL 08 HL 0 BHL 0 EHL 11 HL 14 HL 17 HL 1 AHL 1 DHL 20 HL 23 HL 26 HL 29 HL 2 CHL 2 FHL DIG1 DIG2 DIG3 DIG4 DIG5 DIG6 DIG7 DIG8 DIG9 DIG10 DIG11 DIG12 DIG13 DIG14 DIG15 DIG16
b0 XX HL
b3 b4 XX HU
b7
Lower 4 bits
Higher 4 bits
Only the lower 4 bits of the addresses assigned to Seg17 through Seg20 are valid, and the higher 4 bits are ignored.
5
PD16311
Key Matrix and Key-Input Data Storage RAM The key matrix is of 12 4 configuration, as shown below.
KEY1 KEY2 KEY3 KEY4
Seg10/KS10
Seg11/KS11
The data of each key is stored as illustrated below, and is read by a read command, starting from the least significant bit.
KEY1...KEY4 Seg1/KS1 Seg3/KS3 Seg5/KS5 Seg7/KS7 Seg9/KS9 Seg11/KS11 b0------------ b3 KEY1...KEY4 Seg2/KS2 Seg4/KS4 Seg6/KS6 Seg8/KS8 Seg10/KS10 Seg12/KS12 b4 ------------b7 Reading sequence
When the most significant bit of data (Seg12 b7) has been read, the least significant bit of the next data (Seg1 b0) is read. LED Port Data is written to the LED port by a write command, starting from the least significant bit of the port. When a bit of this port is 0, the corresponding LED lights; when the bit is 1, the LED goes off. The data of bits 6 through 8 is ignored.
MSB - - - b4 b3 b2 b1 LSB b0
LED1 Don't care LED2 LED3 LED4 LED5
On power application, all the LEDs remain dark.
6
Seg12/KS12
Seg1/KS1
Seg2/KS2
Seg3/KS3
Seg4/KS4
Seg5/KS5
Seg6/KS6
Seg7/KS7
Seg8/KS8
Seg9/KS9
PD16311
SW Data The SW data is read by a read command, starting from the least significant bit. Bits 5 through 8 of the SW data are 0.
MSB 0 0 0 0 b3 b2 b1 LSB b0
SW1 SW2 SW3 SW4
Command A command sets the display mode and status of the FIP driver. The first 1 byte input to the PD16311 through the DIN pin after the STB pin has fallen is regarded as a command. If STB is made high while a command/data is transmitted, serial communication is initialized, and the command/data being transmitted is invalid (however, the command/data already transmitted remains valid). (1) Display mode setting command This command initializes the PD16311 and selects the number of segments and number of grids (1/8 to 1/16 duty, 12 segments to 20 segments). When this command is executed, display is forcibly turned off, and key scanning is also stopped. To resume display, a display ON command must be executed. If the same mode is selected, however, nothing is performed.
MSB 0 0 - - b3 b2 b1 LSB b0
Don't care
Selects display mode 0xxx : 8 digits, 20 segments 1000 : 9 digits, 19 segments 1001 : 10 digits, 18 segments 1010 : 11 digits, 17 segments 1011 : 12 digits, 16 segments 1100 : 13 digits, 15 segments 1101 : 14 digits, 14segments 1110 : 15 digits, 13 segments 1111 : 16 digits, 12 segments
On power application, the 16-digit, 12-segment mode is selected.
7
PD16311
(2) Data setting command This command sets data write and data read modes.
MSB 0 1 - - b3 b2 b1 LSB b0
Don't care
Sets data write and read modes. 00 : Writes data to display memory. 01 : Writes data to LED port. 10 : Reads key data. 11 : Reads SW data.
Sets address increment mode (display memory). 0 : Increments address after data has been written. 1 : Fixes address.
Sets test mode 0 : Normal operation 1 : Test mode
On power application, the normal operation mode and address increment mode are set. (3) Address setting command This command sets an address of the display memory.
MSB 1 1 b5 b4 b3 b2 b1 LSB b0
Address (00H - 2FH)
If address 30H or higher is set, the data is ignored, until a correct address is set. On power application, the address is set to 00H.
8
PD16311
(4) Display control command
MSB 1 0 - - b3 b2 b1 LSB b0
Don't care
Sets dimming quantity. 000 : Sets pulse width to 1/16. 001 : Sets pulse width to 2/16. 010 : Sets pulse width to 4/16. 011 : Sets pulse width to 10/16. 100 : Sets pulse width to 11/16. 101 : Sets pulse width to 12/16. 110 : Sets pulse width to 13/16. 111 : Sets pulse width to 14/16.
Turns on/off display. 0 : Display off (key scan continues*) 1 : Display on
On power application, the 1/16-pulse width is set and the display is turned off. *: On power application, key scanning is stopped.
9
PD16311
Key Scanning and Display Timing
TDISP = 500 s Key scan data
SEG Output
DIG1
DIG2
DIG3
DIGn
DIG1
G1
G2
1/16 TDISP
G3
Gn
1 frame = TDISP x (n + 1)
One cycle of key scanning consists of two frames, and data of 12 4 matrices is stored in RAM.
10
PD16311
Serial Communication Format Reception (command/data write)
If data is contiguous
STB
DIN
b0
b1
b2
b6
b7
CLK
1
2
3
7
8
Transmission (data read)
STB DIN CLK DOUT b0 1 b1 2 b2 3 b3 4 b4 5 b5 6 b6 7 b7 8 1 b0 2 b1 3 b2 4 b3 5 b4 6 b5
tWAIT*
Data reading command is set.
Data reading starts.
Because the DOUT pin is an N-ch, open-drain output pin, be sure to connect an external pull-up resistor to this pin (1 k to 10 k). *: When data is read, a wait time tWAIT of 1 s is necessary since the rising of the eighth clock that has set the command, until the falling of the first clock that has read the data.
11
PD16311
ABSOLUTE MAXIMUM RATINGS (Ta = 25 C, VSS = 0 V)
PARAMETER Logic Supply Voltage Driver Supply Voltage Logic Input Voltage FIP Driver Output Voltage LED Driver Output Current FIP Driver Output Current SYMBOL VDD VEE VI1 VO2 IO1 IO2 RATINGS UNIT V V V V mA mA
0.5 to +7.0
VDD +0.5 to VDD 40
0.5 to VDD +0.5
VEE 0.5 to VDD +0.5 +25
40 (grid) 15 (segment)
1200*
Power Dissipation Operating Ambient Temperature Storage Temperature
PD Topt Tstg
mW
40 to +85 65 to +150
C C
*: Derate at 9.6 mW/C at Ta = 25 C or higher.
RECOMMENDED OPERATING CONDITIONS (Ta = 20 to +70 C, VSS = 0 V)
PARAMETER Logic Supply Voltage High-Level Input Voltage Low-Level Input Voltage Driver Supply Votlage SYMBOL VDD VIH VIL VEE MIN. 4.5 0.7 VDD 0 0 TYP. 5 MAX. 5.5 VDD 0.3 VDD VDD 35 UNIT V V V V TEST CONDITIONS
Maximum power consumption PMAX. = FIP driver dissipation + RL dissipation + LED driver dissipation + dynamic power consumption Where segment current = 3 mA, grid current = 15 mA, and LED current = 20 mA, FIP driver dissipation = number of segments 6 + number of grids/(number of grids + 1) 30 (mW) RL dissipation = (VDD VEE) /50 (segment + 1) (mW)
2
LED driver dissipation = number of LEDs 20 (mW) Dynamic power consumption = VDD 5 (mW) Example Where VEE = 30 V, VDD = 5 V, and in 16-segment and 12-digit modes, FIP driver dissipation = 16 6 +12/13 35 = 128 RL dissipation = 35 /50 17 = 417
2
LED driver dissipation = 5 20 = 100 Dynamic power consumption = 5 5 = 25 Total 670 mW
12
PD16311
ELECTRICAL SPECIFICATIONS (Ta = 20 to +70 C, VDD = 4.5 to 5.5 V, VSS = 0 V, VEE = VDD 35 V)
PARAMETER High-Level Output Voltage Low-Level Output Voltage Low-Level Output Voltage High-Level Output Current High-Level Output Current SYMBOL VOH1 VOL1 VOL2 IOH21 IOH22 MIN. 0.9 VDD 1 0.4 TYP. MAX. UNIT V V V mA mA TEST CONDITIONS LED1 LED5, IOH1 = 1 mA LED1 LED5, IOL1 = 20 mA DOUT, IOL2 = 4 mA VO = VDD 2 V, Seg1 to Seg12 VO = VDD 2 V, Grid1 to Grid8, Seg13/ Grid16 to Seg12/ Grid9 VO = VDD 35 V, driver off Driver output VI = VDD or VSS
3 15 10
50 100 150
Driver Leakage Current Output Pull-Down Resistor Input Current High-Level Input Voltage Low-Level Input Voltage Hysteresis Voltage Dynamic Current Consumption
IOLEAK RL II VIH VIL VH IDDdyn 0.35 0.7 VDD
A
K
1
A
V
0.3 VDD
V V CLK, DIN, STB Under no load, display off
5
mA
SWITCHING CHARACTERISTICS (Ta = 20 to +70 C, VDD = 4.5 to 5.5 V, VEE = 30 V)
PARAMETER Oscillation Frequency Propagation Delay Time SYMBOL tOSC tPLZ tPZL Rise Time tTZH1 tTZH2 MIN. 350 TYP. 500 MAX. 650 300 100 2 0.5 UNIT kHz ns ns TEST CONDITIONS R = 56 k CLK DOUT CL = 15 pF, RL = 10 k CL = 300 pF Seg1 to Seg12 Grid1 to Grid8, Seg13/Grid16 to Seg20/Grid9 CL = 300 pF, Segn, Gridn Duty = 50 %
s s
Fall time Maximum Clock Frequency Input Capacitance
tTHZ fmax. CI 1
120
s
MHz
15
pF
TIMING CONDITIONS (Ta = 20 to +70 C, VDD = 4.5 to 5.5 V)
PARAMETER Clock Pulse Width Strobe Pulse Width Data Setup Time Data Hold Time Clock-Strobe Time Wait Time SYMBOL PWCLK PWSTB tSETUP tHOLD tCLK-STB tWAIT MIN. 400 1 100 100 1 1 TYP. MAX. UNIT ns TEST CONDITIONS
s
ns ns
s s
CLK STB CLK CLK *
*: Refer to page 11.
13
PD16311
Switching Characteristic Waveform
fOSC
OSC 50 %
PWSTB
STB PWCLK PWCLK tCLK-STB
CLK
tSETUP
tHOLD
DIN tPZL DOUT tPLZ
tTHZ 90 % Sn/Gn 10 %
tTZH
14
PD16311
Applications Updating display memory by incrementing address
STB
CLK
DIN
Command 1
Command 2
Command 3
Data 1
Data n
Command 4
Command 1: sets display mode Command 2: sets data Command 3: sets address Data 1 to n: transfers display data (48 bytes max.) Command 4: controls diplay Updating specific address
STB
CLK
DIN
Command 1
Command 2
Data
Command 2
Data
Command 1: sets data Command 2: sets address Data: display data
15
PD16311
RECOMMENDED SOLDERING CONDITIONS
The following conditions (see table below) must be met when soldering this product. Please consult with our sales officers in case other soldering process is used or in case soldering is done under different conditions.
PD16311GC-AB6
Soldering process Infrared ray reflow Soldering conditions Peak package's surface temperature: 235 C or below, Reflow time: 30 seconds or below (210 C or higher), Number of reflow process: 2, Exposure limit*: None Peak package's surface temperature: 215 C or below, Reflow time: 40 seconds or below (200 C or higher), Number of reflow process: 2, Exposure limit*: None Solder temperature: 260 C or below, Flow time: 10 seconds or below, Number of flow process: 1, Exposure limit*: None Terminal temperature: 300 C or below, Flow time: 10 seconds or below, Exposure limit*: None Symbol IR35-00-2
VPS
VP15-00-2
Wave soldering
WS60-00-1
Partial heating method
* Exposure limit before soldering after dry-pack package is opened. Storage conditions: 25 C and relative humidity at 65 % or less. Note Do not apply more than a single process at once, except for "Partial heating method".
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PD16311
52 PIN PLASTIC QFP (14 x 14)
A B
39 40
27 26
detail of lead end
C
D
S Q R
52 1
14 13
F
G H P I
M
J K M N
L
ITEM A B C D F G H I J K L M N P Q R S MILLIMETERS 17.60.4 14.00.2 14.00.2 17.60.4 1.0 1.0 0.400.10 0.20 1.0 (T.P.) 1.80.2 0.80.2 0.15 +0.10 -0.05 0.10 2.6 0.10.1 55 3.0 MAX. INCHES 0.6930.016 0.551 +0.009 -0.008 0.551 +0.009 -0.008 0.6930.016 0.039 0.039 0.016 +0.004 -0.005 0.008 0.039 (T.P.) 0.071 +0.008 -0.009 0.031 +0.009 -0.008 0.006 +0.004 -0.003 0.004 0.102 0.0040.004 55 0.119 MAX. P52GC-100-AB6-4
NOTE Each lead centerline is located within 0.20 mm (0.008 inch) of its true position (T.P.) at maximum material condition.
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PD16311
[MEMO]
18
PD16311
[MEMO]
19
PD16311
FIPTM is a trademark of NEC Corporation.
No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document. NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others. While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features. NEC devices are classified into the following three quality grades: "Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a customer designated "quality assurance program" for a specific application. The recommended applications of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device before using it in a particular application. Standard: Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact an NEC sales representative in advance. Anti-radioactive design is not implemented in this product.
M4 96. 5

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